Nanotech 2012 Vol. 2
Nanotech 2012 Vol. 2
Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)

Modeling & Simulation of Microsystems Chapter 8

Design of ASIC Dedicated to Thermal Analysis of Many-Core Architectures

Authors: M. Szermer, L. Kotynia, P. Pietrzak, M. Janicki, A. Napieralski

Affilation: Technical University of Lodz, Poland

Pages: 562 - 565

Keywords: many-core architecture, thermal coupling, ASIC

The main goal of the paper is to present the design of an ASIC dedicated to thermal analysis of many-core architectures. Due to the fact that the process of designing real multi-core microprocessors is expensive and time consuming, the authors decided to design a special test ASIC which will be used (together with a dedicated simulator) to estimate thermal dependencies between cores in many-core processors. The presented ASIC consists of 384 heat cells which represent the power dissipation sources in real many-core microprocessors. These heat cells create a 10x24 array. The presented ASIC is a part of a project aimed at defining the thermal coupling coefficients between cores in many-core architectures using a dedicated thermal-logic simulator. The proposed ASIC will be used for empirical verification of this method. The full paper will present in detail the architecture and the simulation results of this ASIC.

ISBN: 978-1-4665-6275-2
Pages: 878
Hardcopy: $209.95

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