Nanotech 2011 Vol. 2
Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Advanced Packaging and Compound Semiconductors Chapter 6

Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications
K-L Suk, K.W. Paik

Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging
F. Gao, Z. Gu, S. Shina, G. Morose, P. Eliason, R. Farrell
University of Massachusetts Lowell, US

Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste
A. Hirose, T. Itou, T. Ogura
Osaka University, JP

Compliant interconnect technology for power modules in automotive applications
P. Nenzi
University of Rome la Sapienza, IT

u-Helix 3D-antenna technology
P. Nenzi
Sapienza - Università di Roma, IT

Supramolecular Dielectric for Low Voltage Organic Electronics
H.-C.L. Tsui, J. Steinke, A. Campbell
Imperial College London, UK

Thin film transistors with printed semiconductive oxide channel and silver source-drain electrodes
Z. Chen, Z. Cui
Suzhou Institute of Nano-tech and Nano-bonic, Chinese Academy of Sciences, CN

ISBN: 978-1-4398-7139-3
Pages: 854
Hardcopy: $199.95