Nanotech 2011 Vol. 2
Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Micro & Nano Reliability Chapter 3

Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography

Authors: J. Hammacher, M. Dost, W. Faust, L. Scheiter, R. Erb, B. Michel

Affilation: Fraunhofer ENAS, Germany

Pages: 141 - 144

Keywords: x-ray computertomography, digital image correlation, loading equipment

High resolution x-ray computertomography allows the non-destructive 3D-analysis of materials and compounds. Therefore, information of the internal structure of the material or the device becomes available, which are otherwise only gained by destructive analysis. But there is still a high deficit in the analysis of thermal-mechanical caused local variations in the volume, which is especially required for failure analysis or for the evaluation of the deformation behaviour of devices. Such variations can be easily analyzed and documented, by means of the high resolution computertomography. We will present the development of a special thermal loading equipment for the nanotom CT-system and the development of the conventional 2D digital image correlation (DIC) towards 3D requirements. The in-house developed evaluation process allows the possibility of a three-dimensional quantitative and qualitative acquisition of the deformed volumes for the first time. We are going to demonstrate the method and first results of the three-dimensional evaluation on the basis of examples.

ISBN: 978-1-4398-7139-3
Pages: 854
Hardcopy: $199.95

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