Authors: S. Mishin, Y. Oshmyansky, F. Bi
Affilation: Advanced Modular Systems, Inc, United States
Pages: 288 - 291
Keywords: FBAR, trimming, ion milling, SiO2, AlN
A practical approach to addressing production issues of thickness trimming was demonstrated through two-step trimming, send-ahead wafer, and deposition/trimming cluster tool. Thickness control necessary in SAW/BAW technology was demonstrated.