Nanotech 2010 Vol. 2
Nanotech 2010 Vol. 2
Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Micro & Nano Reliability Chapter 3

Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies
M.H. Shirangi, M. Koyuncu, J. Keller, B. Michel
Bosch Mahle TS GmbH, DE

In-situ MEMS Testing
A. Dommann, A. Neels, A. Schifferle, E. Mazza

A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation
M. Roellig, R. Metasch, K. Meier
Fraunhofer Institute for Non-Destructive Testing, DE

A Multiscale Modeling Approach for Microelectronic Packaging Applications
N. Iwamoto, O. Hölck, S. Noijen, B. Wunderle, S. Todd
Honeywell Specialty Materials, US

Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers
H. Walter, E. Dermitzaki, B. Wunderle, B. Michel
Fraunhofer IZM, DE

Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS
A. Neels, A. Dommann

Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability
B. Michel, J. Hammacher, T. Winkler, E. Kaulfersch
Fraunhofer ENAS, DE

ISBN: 978-1-4398-3402-2
Pages: 862
Hardcopy: $189.95