Authors: T. Schmidt, M. Mielke, K. Hahn, D. Ortloff, J. Popp, R. Brueck
Affilation: University of Siegen, Germany
Pages: 673 - 676
Keywords: MEMS, TCAD, cross-section, process, manufacturing
With MEMS entering fast moving consumer markets the need for more efficient design concepts becomes apparent. A technology centered approach where a product is designed around a highly specialized and optimized technology cannot cope with short product cycles and fast changing market demands. There is no common technology platform or design abstraction in sight. The only apparent solution seems to be modularization and re-use of existing manufacturing technology. Successful process design thus depends on a comprehensive management of manufacturing related knowledge. In this paper we propose a visual approach on process modeling by presenting a software tool that supports the device engineer in specifying a set of device cross-sections that satisfy the specific requirements of thin film manufacturing processes. The drawing tools are modeled to represent typical effects of thin-film semiconductor fabrication techniques. A geometrical analysis performed in the background ensures that it adheres to the constraints of thin film manufacturing. Additional functional aspects (e.g. cantilever) and non-geometric constraints (e.g. conductivity, material) can be specified for every geometric component. Further integrated analysis algorithms provide automatic identification of layer structures and layer modifications and recommends manufacturing sequences. The tool is currently under evaluation within the European project CORONA (CP-FP 213969-2).
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