Authors: J. Cao, A. Arun, K. Lister, D. Acquaviva, J. Bhandari, A.M. Ionescu
Affilation: École Polytechnique Fédérale de Lausanne, Switzerland
Pages: 282 - 285
Keywords: SWCNT, precise positioning, self-assembled, AC-dielectrophoresis, SWCNT resonator arrays
A novel wafer level assembly method to fabricate SWCNT arrays with precise positioning of each individual SWCNT by ac-dielectrophoresis (DEP) is presented. Unlike the previous CNT assembly performed directly between electrode pairs, in this work, by means of patterned trenches in “Sandwich”-like resist layers, super-aligned SWCNT arrays with controllable SWCNT number and location can be achieved on various substrate geometries. Furthermore, we demonstrate very high densities (~100 million/cm2) of double clamped SWCNT arrays, two orders of magnitude higher than earlier work. This self-assembled technique could enable a precise positioning with deep sub-micron control at wafer level for the fabrication of future NEMS devices, such as SWCNT resonator arrays for RF or sensing applications. The method described in this report is very versatile, as it is fully compatible with a variety of pre- and post-processing of SWCNT and the substrate, facilitating future electrical connection of SWCNTs to underlying Si circuitry.