Authors: K.K. Varanasi, P. Chamarthy, S. Chauhan, P. de Bock, A. Kulkarni, G. Mandrusiak, B. Rush, B. Russ, L. Denault, S. Weaver, F. Gerner, Q. Leland, K. Yerkes
Affilation: Massachusetts Institute of Technology, United States
Pages: 505 - 508
Keywords: heat pipes, electronic cooling, wettability, superhydrophobic, superhydrophilic
In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.