Berthier J., Grossi F., Di Cioccio L.
CEA/LETI/MINATEC, FR
Keywords: alignment, die, minimal surface, modes, roll, yaw
To create advanced Microsystems by 3D integration, die-to-wafer assembly is required to obtain fast and reliable packaging. In order to overcome the main difficulties of current techniques, self-assembly methods are promising due to their serial aspect. The aim of this work is to understand the mechanisms of self alignment. Using “Surface Evolver” software, we were able to study misalignments of the system and their evolutions.
Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling
Published: May 3, 2009
Pages: 260 - 263
Industry sector: Advanced Materials & Manufacturing
Topic: Informatics, Modeling & Simulation
ISBN: 978-1-4398-1784-1