Authors: Y. Mahotin, S. Tirumala, X. Lin and D. Pramanik
Affilation: Synopsys Inc., United States
Pages: 684 - 686
Keywords: SPICE model, process aware
This paper describes the methodology for extraction of process dependant hybrid SPICE compact model parameters using calibrated TCAD data and measured Silicon data. Process dependence of electrical curves is, initially, estimated using TCAD data set. The knowledge of process dependence is subsequently utilized to generate device electrical curves centered on typical measured Silicon data. These newly generated device electrical curves are used to extract hybrid SPICE model parameters as explicit functions of process parameter variations.