Nanotech 2006 Vol. 3
Nanotech 2006 Vol. 3
Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3

Nanoscale Fabrication Chapter 2

Multiple Wafer Bonding Offers Increased Throughput of High Brightness LEDs

Authors: D.N. Pascual

Affilation: SUSS MicroTec, United States

Pages: 303 - 305

Keywords: wafer bond, LED, high brigthness, throughput

We have developed a new wafer-bonding process and equipment for significantly increasing the throughput of high-brightness light emitting diodes and other devices that could benefit from group semiconductor wafer bonding. I will present this solution in more detail while explaining the technical limitations and requisites for successful implementation. Utility of the method will be demonstrated with experimental results from previously bonded wafers.

ISBN: 0-9767985-8-1
Pages: 913
Hardcopy: $119.95

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