Nanotech 2005 Vol. 3
Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3

MEMS Modeling and Design Chapter 9

Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis

Authors: S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, R. Entner, E. Langer, T. Grasser and S. Selberherr

Affilation: Vienna University of Technology, Austria

Pages: 620 - 623

Keywords: transient electro-thermal simulation, thermal stress, stress analysis, electromigration, transient simulation, interconnect

We introduce the combination of three-dimensional transient electro-thermal interconnect simulations for intrinsic thermo-mechanical stress problems. In order to study the development of thermal stresses we use a finite element simulator for the investigation on stresses of complex layered interconnect structures at different operating conditions. Together with the potential distribution we obtain the complete input data for accurate electromigration analysis.

ISBN: 0-9767985-2-2
Pages: 786
Hardcopy: $109.95

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