Nanotech 2005 Vol. 3
Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3

Characterization and Parameter Extraction Chapter 6

Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
P. Szabo, G. Perlaky, Gy. Bognar, Gy. Horvath, S. Ress, A. Poppe, V. Szekely, M. Rencz and B. Courtois
Budapest University of Technology and Economics, HU

Application of MCLC Method for Estimating the Parameters of MEMS Sensors
E. Colinet, J. Juillard and L. Nicu

On the Determination of Thermal Expansion Coefficient of Thermal Oxide
C. Tsou, Y.S. Huang and H.C. Chang
Department of Automatic Control Engineering, Feng Chia University, TW

The Modeling and Characterization of Nano-Scale MOSFET Resistance
J-H Lee, H-J Lee, W-H Lee, E-S Kang, J-Y Lee, K-R Byun, J-W Kang, H-J Hwang and O-K Kwon
Sangmyung University, KR

In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon
F. Cacchione, B. De Masi, A. Corigliano, M. Ferrera and A. Vinay
Politecnico di Milano, IT

ISBN: 0-9767985-2-2
Pages: 786
Hardcopy: $109.95