Nanotech 2004 Vol. 3
Nanotech 2004 Vol. 3
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3

Micro and Nano Structuring and Assembly Chapter 10

Microcap Selective Packaging through Flip Chip Alignment

Authors: C.H. Chao and C.T. Pan

Affilation: National Sun Yat-Sen University, Taiwan

Pages: 472 - 475

Keywords: flip-chip, passivation, microcap, wafer level, MEMS process

In this study, the technique of microcap selective bonding for 3-D microstructures using MEMS processes was presented. The flip-chip assembly was successfully demonstrated that the microcap transferred on the selective area of the host substrate through wafer level alignment. A new packaging technique of microcap with passivation treatment was developed for selective packaging. The metal Ni microcap is superior to those using thin film poly-silicon by surface micromachining technique due to the high stiffness structure. Photo definable material was served as the bonding adhesive layer between the silicon wafer and metal microcap. For the bonding process, several types of photo definable material were explored to characterize for bonding strength. The result shows that excellent bonding strength under bonding temperature can be achieved.

ISBN: 0-9728422-9-2
Pages: 561
Hardcopy: $79.95