Authors: D.S Eun, Y.M. Kim, CH.H. Bae, J.H. Lee
Affilation: Kyungpook National University, Korea
Pages: 400 - 403
Therefore, this paper reports 3-dimensional Cu coaxial cylinder with a thick OPS(oxidized porous silicon) in low resistivity silicon for application of microwave and RF integrated circuit technology. A novel on-chip 3D coaxial cylinder was fabricated by bulk and surface micromachined process. It was utilized deformation of sacrificial photoresist and electroplating and etching. In conclusion, we propose a novel 3-D coaxial cylinder structure fabricated by anodic reaction, electroplating, and micromachining technology. The structure is expected to improve the insertion loss characteristics, the transmission line dispersion characteristics and can be used as micro-size coaxial cylinder.