Nanotech 2003 Vol. 2
Nanotech 2003 Vol. 2
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2

RF Device Design Chapter 8

Ultra Thin Packaging of the RF-MEMS Devices with Low loss

Authors: Y.K. Park, Y.K. Kim, H. Kim, D.J. Lee, H-W. Park, C.J. Kim and B.K. Ju

Affilation: Korea Institute of Science and Technology, Korea

Pages: 384 - 387

Keywords: packging, ultra thin, RF-MEMS

RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was used as capping substrate, we proposed ultra thin chip size RF-MEMS packaging technology that has vertical feed-through, ultra thin thickness (

ISBN: 0-9728422-1-7
Pages: 600

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