Symposium Spotlight: "Inkjet"
01/17/17 05:07 PM EST
TechConnect interviews the "Inkjet" Symposium Chair, Chris Menzel, a Principal Technologist, at FujiFilm Dimatix. The symposium will take place at the TechConnect World Innovation Conference in May 2017.
DoD Joint Program Committee 1 (JPC-1)/ Medical Simulation and Information Sciences (MSIS) Developing Models for Military and/or Civilian Med
01/13/17 12:14 PM EST
Deadline: March 1, 2017
Building America Industry Partnerships for High Performance Housing Innovation - 2017
01/10/17 04:44 PM EST
Deadline: Feb 01, 2017
Fuel Cells Technologies Office Annual Funding Opportunity Announcement
01/10/17 04:01 PM EST
Deadline: Feb 21, 2017
Symposium Spotlight: "Micro & Bio Fluidics, Lab-on-Chip (LOC)"
11/18/16 03:08 PM EST
Learn about TechConnect's Micro & Bio Fluidics, Lab-on-Chip (LOC) Symposium and the greatest areas of interest and possible applications in the field. Dr. Edward Furlani of the University at Buffalo will be chairing the symposium.
Military Medical Photonics Program Department of Defense Air Force Office of Scientific Research
11/16/16 04:15 PM EST
Deadline: December 31, 2016
Designing Materials to Revolutionize and Engineer our Future
11/16/16 03:39 PM EST
Deadline: Jan 17, 2017
Symposium Spotlight: "Graphene & 2D-Materials"
10/31/16 05:20 PM EST
TechConnect interviews the "Graphene & 2D-Materials" Symposium Chair, Elena Polyakova, co-founder of Graphene 3D Lab and Graphene Laboratories. The symposium will take place at the TechConnect World Innovation Conference in May 2017.
Symposium Spotlight: "Printed and Flexible Electronics"
10/31/16 01:38 AM EST
The "Printed and Flexible Electronics" symposium will be taking place at TechConnect World Innovation Conference, May 2017 in DC. TechConnect interviews symposium chair, Mandakini Kanungo, Senior Scientist at Xerox Corporation.
Symposium Spotlight: "Sensors – Chemical, Physical and Bio"
10/31/16 01:12 AM EST
TechConnect speaks with Dalia Yablon, Symposium Chair of the "Sensors - Chemical, Physical and Bio" symposium being held at TechConnect World Innovation Conference next May.