IP Profile: A novel nanocavity sensor for ultrasensitive, label-free biomolecular detection
A unique nanostructure is being developed for multimodel, multiplex biological and chemical sensing.
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IP Profile: Electrodeposition of Sol-Gel Films
Yissum has developed a platform technology for thin film deposition. The electroplating method for preparing sol-gel thin films allows for the coating of complex shaped objects.
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TechConnect Summit 2010 To Bring Expanded Program and Marketplace Expo to Anaheim, CA
TechConnect is the World’s Largest Commercialization and Corporate Partnering Forum for Emerging Technologies, Including Nano, Clean, and Bio
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University of South Australia Opens Multi-Million Environmental Research Facility
State of the art building will tackle environmental issues, including water desalination and crop quality using emerging technologies
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Nanotech-enabled Consumer Products Now Number Over 1,000
Adoption of nanotechnology into the everyday continues to grow
[more]
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TechConnect is a global technology outreach & development organization. We are dedicated to locating the world’s most promising advanced technology sectors and assisting in the development of ecosystems focused on accelerating the flow of technologies from the research phase to the viable market phase.
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Published by
Jennifer Rocha
Publishing Director
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TechConnect
955 Massachusetts Ave. #313
Cambridge, MA 02139, U.S.A.
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