2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

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TechConnect Summit
Clean Technology 2008

Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications

S. Fiedler, M. Zwanzig, M.S. Jäger, M. Böttcher
Fraunhofer Institute for Reliability and Microintegration, DE

nanowires, packaging

Individual submicron particles produced by non-lithographic techniques can be attractive for future microelectronic applications. Their touchless manipulation is a necessary prerequisite to use them, since they are too small to be handled via Pick&Place. We propose a combination of dielectrophoretic and acoustic trapping for the separation and oriented positioning on microelectronic substrates of metal and semiconductor wires. Chiplets, rods, and spheres consisting of different materials can be manipulated by dielectrophoresis and standing ultrasonic waves inside microfluidic channels covering object sizes from micron to submicron and nano scale. Based on experimental work we show that technical principles, established and still under development for the bio-technological manipulation of single living cells and other microparticles can be adapted for the integration of miniaturized components into microelectronic periphery. These handling techniques for tiny and delicate individual parts to be developped for microelectronic packaging will ultimatively require the use of carrier liquids which facilitate supplementing self-assembly strategies.

Nanotech 2008 Conference Program Abstract