2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

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TechConnect Summit
Clean Technology 2008

Non traditional dicing of MEMS devices

S. Sullivan, T. Yoshikawa

dicing, MEMS, laser, contamination, vibration, thermal, ESD

Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS.

Nanotech 2008 Conference Program Abstract