TCAD Thermal Analysis of Gate Workfunction Engineered Recessed Channel MOSFET

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This paper discusses the thermal analysis of Gate Electrode Workfunction Engineered Recessed Channel (GEWE-RC) MOSFET involving an RC and GEWE design integrated onto a conventional MOSFET. Furthermore, it focuses on the comparative study of conventional MOSFET with GEWE-RC MOSFET in terms of various thermal parameters such as lattice temperature, heat conductivity, heat capacity and impact generation rate. This paper thus optimizes and predicts the feasibility of a novel design, i.e., GEWE-RC MOSFET for high-performance applications where self-heating effects and thermal behavior is a major concern. TCAD simulations using ATLAS demonstrate that the GEWE-RC MOSFET structure exhibits significantly improved thermal performance, where low power consumption is required and in digital logic and memory applications where fast switching action of MOS is needed.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2014: MEMS, Fluidics, Bio Systems, Medical, Computational & Photonics
Published: June 15, 2014
Pages: 85 - 88
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4822-5827-1