Authors: S.F. Halim
Affilation: National Institute for Standards, Egypt
Pages: 275 - 278
Keywords: epoxy resin, nano-Al2O3, reology, gelation time, curing
Epoxy resins based composites are used as laminates for printed circuits boards, aerospace, ballistic and engineering hardware components, automotive parts, electrical components and rehabilitation products. However, some of its interior characteristics such as thermal stability, weather resistance and impact strength restrict their use in high performance applications.Alumina nanoparticles, which are cheap and can be easily functionalized have been used as fillers in epoxy matrix. A resin mix 090615 LY with 30% dispersed alumina nanoparticle (nano-Al2O3) was added to hot curing epoxy system ( based on 2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin resin / an anhydride hardener/ an imidazole accelerator) such that the nano-Al2O3 concentrations are 0, 2, 5, 10 % by weight. The influence of Al2O3 nanoparticles concentration on the viscosity and curing of the epoxy systems was investigated using temperature-modulated differential scanning calorimetry (TMDSC) and parallel plates rheometer. The effect of nano-Al2O3 on the resin viscosity and gel time (Tgel) were studied. The change in values of enthalpy, glass transition temperature (Tg) and degree of cure (α) versus nano-Al2O3 concentration were investigated.