Authors: H-W Su, Y-Y Chen, C-Y Chen, H-W Cheng, H-T Chang, Yiming Li
Affilation: National Chiao Tung University, Taiwan
Pages: 31 - 34
Keywords: random work function fluctuation, bulk FinFET, SOI FinFET, TiN gate, grain size
This work studies the metal gate’s work function fluctuation induced DC characteristic fluctuation in the 16-nm bulk and silicon-on-insulator (SOI) fin-type field effect transistor (FinFET) devices using an experimentally calibrated 3D device simulation. The method of localized work function fluctuation simulation enables us to estimate local fluctuations including the nanosized grain’s random effects of FinFET with TiN/HfO2 gate stacks. The result of this study shows characteristic fluctuation strongly depends upon the size of localized nanosized metal grains. The shape of grains does have marginal influence on device’s variability.