Nano Science and Technology Institute
Nanotech 2011 Vol. 2
Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Chapter 6:

Advanced Packaging and Compound Semiconductors

-Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications
 K-L Suk, K.W. Paik
-Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging
 F. Gao, Z. Gu, S. Shina, G. Morose, P. Eliason, R. Farrell
 University of Massachusetts Lowell, US
-Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste
 A. Hirose, T. Itou, T. Ogura
 Osaka University, JP
-Compliant interconnect technology for power modules in automotive applications
 P. Nenzi
 University of Rome la Sapienza, IT
-u-Helix 3D-antenna technology
 P. Nenzi
 Sapienza - Universit√† di Roma, IT
-Supramolecular Dielectric for Low Voltage Organic Electronics
 H.-C.L. Tsui, J. Steinke, A. Campbell
 Imperial College London, UK
-Thin film transistors with printed semiconductive oxide channel and silver source-drain electrodes
 Z. Chen, Z. Cui
 Suzhou Institute of Nano-tech and Nano-bonic, Chinese Academy of Sciences, CN
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