Nano Science and Technology Institute
Nanotech 2010 Vol. 2
Nanotech 2010 Vol. 2
Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Chapter 3:

Micro & Nano Reliability

-Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies
 M.H. Shirangi, M. Koyuncu, J. Keller, B. Michel
 Bosch Mahle TS GmbH, DE
-In-situ MEMS Testing
 A. Dommann, A. Neels, A. Schifferle, E. Mazza
-A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation
 M. Roellig, R. Metasch, K. Meier
 Fraunhofer Institute for Non-Destructive Testing, DE
-A Multiscale Modeling Approach for Microelectronic Packaging Applications
 N. Iwamoto, O. Hölck, S. Noijen, B. Wunderle, S. Todd
 Honeywell Specialty Materials, US
-Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers
 H. Walter, E. Dermitzaki, B. Wunderle, B. Michel
 Fraunhofer IZM, DE
-Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS
 A. Neels, A. Dommann
-Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability
 B. Michel, J. Hammacher, T. Winkler, E. Kaulfersch
 Fraunhofer ENAS, DE
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