Authors: S. Sullivan, T. Yoshikawa
Affilation: DISCO Corp., Japan
Pages: 493 - 496
Keywords: dicing, MEMS, laser, contamination, vibration, thermal, ESD
Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS.