Authors: L. Derrig, A. Kuzmin
Affilation: Digital Matrix Corp, United States
Pages: 944 - 946
Keywords: electrolytic, plating, High-Aspect-Ratio
Electroless and Electrolytic plating has had to keep up with the demands in developing new technologies to meet the needs of filling nano and micro structures. Requirements have been for plating angstrom thin layers with an equal deposition over an entire 300 mm wafer, filling high aspect ratio structures with deep side walls, with out voids and plating up varying width structures at the same time Digital Matrix primary function as a company is to manufacture high-speed, high-precision electrolytic plating equipment. With the demands and requests presented to them, they have been frequently asked to solve the plating tribulations created by various aspects of the MEMS/NEMS industries. A few of the more significant technologies performed are: • Digital Matrix process and system can control the plated deposition over the entire wafer surface with a consistent TTV. (Total Thickness Variation) • The process developed by DM allows the plating up of varying width and height structures to grow at the same rate, eliminating the need to slurry away the excess and lose valuable time and precious metals. • Digital Matrix has developed a bump plating process that can over-plate posts/pillars straight up over the Photo Resist or mask, 20 µms with out the mushroom or muffin affect. Larger bumps can be created with a slight mushrooming formation. This technology is being used to replace the need for solder bumps. • Deep posts and side-walls can be plated, filling in the corners and with no trapped voids. • Exact height plating can be achieved, eliminating the need to slurry excess over-plating. • Angles created in Photo Resist can be plated into the deep corners and acute angled side walls without voids.