Nano Science and Technology Institute
Nanotech 2007 Vol. 3
Nanotech 2007 Vol. 3
Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 3

Chapter 2:

MEMS/NEMS: Modeling & Characterization

-The mechanical stiffness and the size effect of the silicon based nano-structures using molecular dynamic (MD) simulation
 C.A. Yuan, O. van der Sluis, G.Q. Zhang, L.J. Ernst, W.D. van Driel and R.B.R. van Silfhout
 Delft University of Technology, NL
-Investigation of Vector Discretization Schemes for Box Volume Methods
 O. Triebl and T. Grasser
 Christian Doppler Laboratory for TCAD in Microelectronics, AT
-A new compact scalable circuit model for RF MEMS switches
 H.M.R. Suy, H.G.A. Huizing, P.G. Steeneken and O.I. Yanson
 NXP Semiconductors, NL
-New Analysis Method for Coupled-Field Micro Devices
 M. Motiee, A. Khajepour and R.R. Mansour
 University of Waterloo, CA
-Frequency Domain Modeling of SAW Devices
 W.C. Wilson and G.M. Atkinson
 NASA Langley Research Center, US
-Modeling and Dynamics of Coupled Dome-shaped Micromechanical Oscillators
 T. Sahai and A.T. Zehnder
 Cornell University, US
-Optimization of Masks for High Aspect Ration UV-Lithographic Patterning
 U. Triltsch and S. Büttgenbach
 Technische Universität Braunschweig, DE
-A Study on the Electrical Properties of Plasma Nitrided Oxide Gate Dielectric in Flash Memory
 M. Park, K. Suh, S. Lee, H. Kang, K. Kim and K. Kim
 Samsung Electronics, KR
-A Method for Semi-Automated Modeling of Analog-Mixed Signal Systems in Automotive Applications based on Transient Simulation Data
 H. Mielenz, R. Doelling and W. Rosenstiel
 Robert Bosch Group, DE
-Genetic Algorithm for the Design of Microchip Flow Cytometers
 H. Bang, W.G. Lee, H. Yun, J.K. Min, C. Chung, J.K. Chang and D.-C. Han
 Seoul National University, KR
-FEM Simulation for demolding process in thermal imprint lithography
 Z. Song, J. Lee and S. Park
 Louisiana State University, US
-Study of Thermal Efficiency Optimization in a Twin-bubble MEMS Micro-injector
 H-K Tang, F-C Tseng, W.W. Wang, I-Y Lee, C-K Lee and K. Lee
 BenQ Corporation, TW
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