Authors: B.C. Lee, J.O. Lee, Y.-K. Choi and J.-B. Yoon
Affilation: Korea Institute of Science and Technology(KIST), Korea
Pages: 45 - 48
Keywords: CNT, RF-MEMS, Inductor, Interconnects
In this works, we developed a top-down fabrication method to pattern and form carbon nanotube(CNT) interconnects with Cu encapsulation. Using this method, we fabricated spiral Cu-encapsulated CNT inductors for RF ICs and investigated the inductance of 0.55nH and quality(Q-) factor of 66 at 8.5GHz.