Tathireddy P., Chakravarthy S., Hsu J., Klein M., Oppermann H., Rieth L., Harrison R., Normann R.A., Solzbacher F.
University of Utah and Fraunhofer Institute, Germany, US
Keywords: biocompatible, electrode arrays, flip chip bonding, stacked hybrid integration
Chronically implantable wireless neural interfaces require biocompatible and stable high density integration of sensing, data processing, communication and power supply. The objective of this research was to develop a biocompatible wafer level integration technology for a stacked hybrid assembly of silicon, polyimide, ceramics and SMD components for the next generation wireless neural interface. The device consists of a 100 channel amplifier, data compression, RF communication, power recovery module, two 60-turn planar coils, SMD components and a Utah Electrode Array (UEA) with metallization on the backside. The coils can be operated as single or switched in parallel or series coils to modify frequency range and voltage gain.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 7, 2006
Pages: 357 - 360
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9767985-8-1