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 | Nanotech 2006 Vol. 3
Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 3: MEMS, NEMS & Sensing |
| | Biocompatible Hybrid System Integration of Silicon Based Neural Interface Device | | Authors: | P. Tathireddy, S. Chakravarthy, J. Hsu, M. Klein, H. Oppermann, L. Rieth, R. Harrison, R.A. Normann, F. Solzbacher | | Affilation: | University of Utah and Fraunhofer Institute, Germany, US | | Pages: | 357 - 360 | | Keywords: | flip chip bonding, stacked hybrid integration, electrode arrays, biocompatible | | Abstract: | Chronically implantable wireless neural interfaces require biocompatible and stable high density integration of sensing, data processing, communication and power supply. The objective of this research was to develop a biocompatible wafer level integration technology for a stacked hybrid assembly of silicon, polyimide, ceramics and SMD components for the next generation wireless neural interface. The device consists of a 100 channel amplifier, data compression, RF communication, power recovery module, two 60-turn planar coils, SMD components and a Utah Electrode Array (UEA) with metallization on the backside. The coils can be operated as single or switched in parallel or series coils to modify frequency range and voltage gain. | | ISBN: | 0-9767985-8-1 |
| Pages: | 913 |
| Hardcopy: | $185.00 |
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