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 | Nanotech 2006 Vol. 3
Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 3: MEMS, NEMS & Sensing |
| | Active Sealing for Soft Poymer Microchips | | Authors: | H. Bang, W.G. Lee, J. Park, H. Yun, J. Lee, S. Chung, K. Cho, C. Chung, D-C Han, and J.K. Chang | | Affilation: | Seoul National University, KR | | Pages: | 405 - 408 | | Keywords: | reversible sealing, microchip, cell assay | | Abstract: | This paper presents a universal sealing method for soft polymer (elastomer) microchips. A robust and reversible sealing method which allows various materials to be bonded and sealed tightly with each other even in aqueous solutions, is developed. The newly developed active sealing method is a robust and universal solution for microchip sealing issues. It will also simplify numerous assays in lab-on-a-chip industries. We strongly believe this will give a universal method for sealing soft polymers with diverse materials in various conditions, and thus open up a new vista for microchip applications. | | ISBN: | 0-9767985-8-1 |
| Pages: | 913 |
| Hardcopy: | $185.00 |
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