Nano Science and Technology Institute
Nanotech 2005 Vol. 3
Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3

Chapter 6:

Characterization and Parameter Extraction

-Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
 P. Szabo, G. Perlaky, Gy. Bognar, Gy. Horvath, S. Ress, A. Poppe, V. Szekely, M. Rencz and B. Courtois
 Budapest University of Technology and Economics, HU
-Application of MCLC Method for Estimating the Parameters of MEMS Sensors
 E. Colinet, J. Juillard and L. Nicu
-On the Determination of Thermal Expansion Coefficient of Thermal Oxide
 C. Tsou, Y.S. Huang and H.C. Chang
 Department of Automatic Control Engineering, Feng Chia University, TW
-The Modeling and Characterization of Nano-Scale MOSFET Resistance
 J-H Lee, H-J Lee, W-H Lee, E-S Kang, J-Y Lee, K-R Byun, J-W Kang, H-J Hwang and O-K Kwon
 Sangmyung University, KR
-In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon
 F. Cacchione, B. De Masi, A. Corigliano, M. Ferrera and A. Vinay
 Politecnico di Milano, IT
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