Papers:
Resolution Enhancement in Nanoimprinting by Surface Energy Engineering
Nanoimprinting lithography was initiated as an alternative way to achieve nanoscale structures with high throughput and low cost. We have developed a UV-nanoimprint process to fabricate 34 by 34 crossbar circuits with a half-pitch of [...]
Wafer Scale Aligned Sub-25nm Metal Nanowires on Silicon (110) using PEDAL Lift-off Process
Sonkusale S.R., Amsinck C.J., Nackashi D.P., Di Spigna N.H., Barlage D., Johnson M., Franzon P.D., North Carolina State University, US
We have demonstrated a new PEDAL process to make sub-25 nm nanowires across the whole wafer. The PEDAL process is useful in the fabrication of metal nanowires directly onto the wafer by doing shadow metalization [...]
Self-Assembled Cluster Nanostructures and Nanodevices
In this paper we will review our efforts over the last few years to achieve contacted electronic devices which are self-assembled from atomic clusters. The focus is on the assembly of nanowires but many aspects [...]
Aspect Ratio Improvement using the 2-step NERIME FIB Top Surface Imaging Process for Nano-lithography Applications
Arshak A., Arshak K., Gilmartin S.F., Collins D., Korostynska O., Arshak A., Arshak K., University of Limerick and Analog Devices, IE
The 2-step NERIME FIB top surface imaging process uses Ga+ ion implantation into resist followed by O2 plasma dry development using reactive ion etching. Previous work has demonstrated this process using 1.5um thick films of [...]
Low Voltage Electron Beam Lithography in PMMA
To examine the practical limits and problems of low voltage operation, we have studied electron beam lithography (EBL) in the low (few keV) to ultra-low (E < 100eV) energy range, employing commonly used resists such [...]
Au Nano-Wire Transferring onto HSQ by Nano Imprinting Technology
Liu J.F., Hsu Y.J., Chen J.H., Chen S.Z., Huang F.S., Chen J.H., Chen S.Z., National Tsing Hua University, TW
In this paper, we present the technique of transferring Au nano-wire on HSQ by using nano imprint. The Au nano-wires were fabricated by electroless-plating and investigated by TEM analysis. The stable nano imprinting and suitable [...]
Sub-100nm and Large Area Pattern Process using by Hybrid Nanocontact Printing (HnCP)
The hybrid nanocontact printing(HnCP) method is a technology for manufacturing an ultra violet(UV) imprinted silicon substrate from a master and then printing by letting it get in contact with a substrate coated with a metal [...]
A Highly Reliable Pattern Transfer of Hydrogen Silsequioxane
Liu J.F., Chen H.J.H., Chen S.Z., Chen H.J.H., Chen S.Z., Huang F.S., National Tsing Hua University, TW
In this paper, we focus on the effects of process parameters on pattern embossing into HSQ films, and the pattern degradation of HSQ for room temperature aging effects. The dilution of HSQ affects not only [...]
Nanoscale Reaction Analysis of Resist Materials for Nanolithography
Recently, in semiconductor industry, elaborate extension of photolithography is getting closer to its capacity limit and post-optical lithographies have attracted much attention ever. Because they are capable of fabricating features below 32 nm, they are [...]
Nano Tungsten Silicide Thin Film Deposition and its Integration with Poly-Silicon
The semiconductor transistor of 90 nm or below generation requires low resistance materials for gate metallization. A thin tungsten silicide (WSix) film is a candidate for the buffer material between poly-silicon and metal, such as [...]
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 8, 2005
Industry sector: Sensors, MEMS, Electronics
Topics: Nanoelectronics, Printed & Flexible Electronics
ISBN: 0-9767985-2-2