Nanotech 2005 Vol. 2
Nanotech 2005 Vol. 2
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 2

NEMS and MEMS Fabrication Chapter 7

Application of Magnetic Neutral Loop Discharge Plasma in Deep Quartz and Silicon Etching Process for MEMS/NEMS Devices Fabrication

Authors: Y. Morikawa, T. Hayashi, K. Suu and M. Ishikawa

Affilation: ULVAC, Inc., Japan

Pages: 501 - 503

Keywords: deep etching, NLD, plasma, modulation

Abstract:
ULVAC’s Si deep etching technique has achieved high etching rate as high as 20 um/min as well as extremely high selectivity over resist mask as high as 100 or higher ensuring good etching performance.


ISBN: 0-9767985-1-4
Pages: 808
Hardcopy: $109.95

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