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 | WCM 2005
Technical Proceedings of the 2005 Workshop on Compact Modeling
Chapter 3: WCM 2004 Invited Papers |
| | Technology Limits and Compact Model for SiGe Scaled FETs | | Authors: | R.W. Dutton and C-H Choi | | Affilation: | Stanford, US | | Pages: | 215 - 218 | | Keywords: | strained-Si, STI, stress, ESD, capacitance | | Abstract: | Stress relaxation in strained-Si MOSFETs can be significant in the presence of compressive stress imposed by trench isolation, especially for highly scaled active regions. Stress of the strained region is reduced by 2/3 when the active region is scaled from Lactive=0.4 µm to 0.1 µm. Mobility can be lower by 50 % for narrow active widths resulting from the strain relaxation. The strain relaxation may restrict the use of strained-Si MOSFETs for technology nodes beyond 25 nm. Electrical and thermal characteristics of strained-Si devices are investigated and a compact junction capacitance model for strained-Si MOSFET suitable for circuit simulation is proposed. |  | View paper | | ISBN: | 0-9767985-3-0 |
| Pages: | 412 |
| Hardcopy: | $120.00 |
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