Nano Science and Technology Institute
Nanotech 2004 Vol. 3
Nanotech 2004 Vol. 3
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3

Chapter 10:

Micro and Nano Structuring and Assembly

-Nano-Structured C60-SAM Formed on Ultrathin Au Films/MgO Single Crystal
 H. Yamamoto, N. Iwata and Y. Shimizu
 Nihon University, College of Science & Technology, JP
-Single-Dot Spectroscopy of Low Density GaAs Quantum Dots Grown by Modified Droplet Epitaxy
 M. Yamagiwa, F. Minami and N. Koguchi
 Tokyo Institute of Technology, JP
-Self-assembled Alternating Nano-scaled Layers
 W-Y Wu and J-M Ting
 National Cheng Kung University, TW
-Fabrication of Metallic Nano-stamper and Replication of Nano-patterned Substrate for Patterned Media
 Y. Kim, N. Lee, Y-J Kim and S. Kang
 Yonsei University, KR
-Nano-Lithography in Ultra-High Vacuum (UHV) for Real World Applications
 J. Gilsinn, H. Zhou, B. Damazo, J. Fu and R. Silver
 NIST, US
-Investigation of Tooling Surfaces on Injection Molded Nanoscale Features
 S-H Yoon, C. Srirojpinyo, J. Lee, C. Sung, J.L. Mead and C.M.F. Barry
 University of Massachusetts at Lowell, US
-Processing Parameters Affecting Nanoinjection Molding
 C. Srirojpinyo, S-H Yoon, J. Lee, C. Sung, J.L. Mead and C.M.F. Barry
 University of Massachusetts Lowell, US
-Interfacial Instabilities in Multilayer Extrusion
 K. Ho, J.S. Lee, N. Viriyabanthorn, C. Sung, C.M.F. Barry and J.L. Mead
 University of Massachusetts Lowell, US
-Microcap Selective Packaging through Flip Chip Alignment
 C.H. Chao and C.T. Pan
 National Sun Yat-Sen University, TW
ISBN:0-9728422-9-2
Pages:561
Hardcopy:$79.95
 
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