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 | Nanotech 2003 Vol. 1
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1
Chapter 13: Wafer and MEMS Processing |
| | Introduction of Micro-Manipulation by Adhesional Force and Dielectric Force | | Authors: | K. Takahashi, Y. An, S. Saito and T. OnzawaTadao | | Affilation: | Tokyo Institute of Technology, JP | | Pages: | 518 - 521 | | Keywords: | manipulation, particle, adhesion, Coulomb interaction | | Abstract: | This paper reports the manipulation by both adhesional force and Coulomb force. Applicability of this method is discussed evaluating both of the forces theoretically and experimentally. Adhesional force can be used as attractive force in manipulation. Coulomb interaction seems a most useful mechanism for generating repulsive force. Boundary element method (BEM) is used to evaluate the forces generated by Coulomb interaction. Calculated results are compared with experimental data. Using above evaluation, the threshold between for adhesion ( pick-up ) and electro-detachment ( place ) can be clearly expressed. |  | View paper | | ISBN: | 0-9728422-0-9 |
| Pages: | 560 |
| Hardcopy: | $125.00 |
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