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 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 9: Software Tools, CAD Systems |
| | Modeling of Stress Induced Hysteresis in Piezo-Resistive Analysis | | Authors: | H.-P. Lien | | Affilation: | ISE, Switzerland | | Pages: | 338 - 341 | | Keywords: | piezo-resistivity, stress compensation, technology CAD, integrated simulation environment | | Abstract: | The impact of mechanical stress on electrical characterizations of microelectronic circuitry is a major design issue in development of sensors and integrated micro-electro-mechanical systems. Because the electrical properties of semiconductors are in uenced by external and thermally induced mechanical stress, the magnitude of such effects should be analyzed during the design process. Such non-linear and hysteresis effects can be modeled and analyzed using state-of-the-art technology CAD (TCAD) tools, providing information about device characteristics prior to production. |  | View paper | | ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
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