Nano Science and Technology Institute - NSTI  
Nano Science and Technology Institute   Home | Subscribe | Site Map  
  ABOUT | COURSES | EVENTS | PUBLICATIONS | LEADERSHIP | OUTREACH | NEWS | PRESS | JOBS | Nanotechnology Solutions
px
px fade_top
Publications
Nanotech 2007 CDROM
Nanotech 2006 CDROM
Nanotech 2005 CDROM
Nanotech 2004 CDROM
3 CDROM Special Offer
Nanotech 2007 Vol. 1
Nanotech 2007 Vol. 2
Nanotech 2007 Vol. 3
Nanotech 2007 Vol. 4
Nanotech 2006 Vol. 1
Nanotech 2006 Vol. 2
Nanotech 2006 Vol. 3
Nanotech 2005 Vol. 1
Nanotech 2005 Vol. 2
Nanotech 2005 Vol. 3
WCM 2005
Nanotech 2004 Vol. 1
Nanotech 2004 Vol. 2
Nanotech 2004 Vol. 3
Nanotech 2003 Vol. 1
Nanotech 2003 Vol. 2
Nanotech 2003 Vol. 3
Nanotech 2002 Vol. 1
Nanotech 2002 Vol. 2
Nanotech 2001 Vol. 1
Nanotech 2001 Vol. 2
MSM 2000
MSM 99
MSM 98
Index of Authors
Index of Keywords
Index of Affiliations
Library Request Form
Shopping Cart
Order Form
 
Publications Publications
MSM 99
p
 
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
 
Chapter 14: Yield and Reliability
 

Numerical Fracture Analysis of MEMS Devices

Authors:N. Tayebi and A.K. Tayebi
Affilation:Case Western Reserve University, U.S.A.
Pages:491 - 494
Keywords:linear elastic fracture mechanics, MEMS reliability, numerical methods, meshless methods, boundary element methods
Abstract:Non-conventional finite element analysis (FEA) based on linear elastic fracture mechanics (LEFM) is applied to fractured MEMS specimens with notches. The objective of this paper is to test the applicability of LEFM at mesoscale and to evaluate the application of newly developed FEA methods to MEMS fracture analysis. The displacement discontinuity method and the element free Galerking meshless method are used. The tested cases consisted of specimens in the form of notched cantilever beams, and double cantilever beams suspended by an anchor by two thin beams. A good correlation with some experiments is obtained.
Numerical Fracture Analysis of MEMS DevicesView paper
ISBN:0-9666135-4-6
Pages:697
Special:3 CD Set — 15% off with Free Shipping
Up
Upcoming Events
Nanotech 2008
Cleantech 2008
BioNano 2008
TechConnect Summit
nanoPRwire™
nanoPRwire
News Headlines
nano World news
 
 
 
 
px
© Nano Science and Technology Institute     About NSTI | Terms of Use | Privacy Policy | Contact