 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 14: Yield and Reliability |
| - | A Simple VLSI Spherical Particle-Induced Yield Predictor |
| | K. Nakamae, H. Ohmori and H. Fujioka |
| | Osaka University, Japan |
| - | Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules |
| | S. Ramminger, G. Mitic, P. Türkes and G. Wachutka |
| | Siemens AG, Germany |
| - | Strength Prediction for MEMS Components Transferring Large Loads |
| | L-H. Chu, Q. Chen and G.P. Carman |
| | University of California, Los Angeles, U.S.A. |
| - | Numerical Fracture Analysis of MEMS Devices |
| | N. Tayebi and A.K. Tayebi |
| | Case Western Reserve University, U.S.A. |
| - | Rapid Reliability Assessment Using CADMP-II |
| | F.P. McCluskey and M. Pecht |
| | University of Maryland, U.S.A. |
| - | Inductive Fault Analysis of a Microresonator |
| | T. Jiang, C. Kellon and R.D. Blanton |
| | Carnegie Mellon University, U.S.A. |
| ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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