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 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 1: Plenary lectures |
| | Virtual Component Qualification | | Authors: | M. Pecht, P. Sandborn and F.P. McCluskey | | Affilation: | University of Maryland, U.S.A. | | Pages: | 8 - 13 | | Keywords: | reliability assessment, virtual qualification, electronic packaging, accelerated testing, CADMP-II | | Abstract: | One of the most time consuming activities in new product development is associated with reliability assessment and qualification. This is defined as a process to verify whether the anticipated reliability is indeed achieved under actual life cycle loads for some specified length of time. Reliability assessment and qualification is usually accomplished by testing under accelerated loads to achieve time compression. Typical qualification methods have been borrowed from the military, without knowledge of the rationale or assessment of the true benefits. In fact, prediction of field reliability from these tests has generally been quite poor. Nevertheless, the amount and length of qualification testing has increased over the years. This paper aims to provide a background to the qualification problem that much of industry is faced with today. Then provide an approach to reliability assessment, which provides a method for qualification requiring very little time and money, because the process is simulated. |  | View paper | | ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
| Hardcopy: | $100.00 |
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