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 | Nanotech 2002 Vol. 1
Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Chapter 8: Process Modeling |
| | Kinetic Monte Carolo Simulation of Thin Film Growth with Void Formation - Application to via Filling | | Authors: | Y. Hiwatari, Y. Kaneko, K. Ohara and T. Murakami | | Affilation: | Kanazawa University, Japan | | Pages: | 430 - 433 | | Keywords: | Monte Carlo simulation, thin film, voids, via filling | | Abstract: | In this paper, we study the void formation during via lling as a model of copper damascene plating for LSI interconnects. We developed a new model for crystal growth which enables us to study the void structure in relation to the surface structure depending upon the deposition conditions. Using this model which we call Solid-by-Solid model, we performed the kinetic Monte Carlo simulations of lling V-shaped and at-bottomed grooves to examine the surface and void structures during the surface growth. It is found that small voids appear successively in the lm, being aligned to the growth direction as the V-shaped groove is lled with deposited atoms. In lling the at-bottomed groove, on the other hand, large voids appear in the middle of the groove which are elongated to the growth direction. The mechanism of lling and void formation and its dependence on the shape of the initial substrate are discussed. |  | View paper | | ISBN: | 0-9708275-7-1 |
| Pages: | 764 |
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