Nano Science and Technology Institute
Nanotech 2002 Vol. 1
Nanotech 2002 Vol. 1
Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems

Chapter 12:

Circuit Simulation

-Compact Thermal Model for Transient Temperature Fields in Electronic Systems
 Y.C. Gerstenmaier and G. Wachutka
 Munich University of Technology, DE
-An Algorithm for the Inclusion of RC Compact Models of Packages into Board Level Thermal Simulation Tools
 M. Rencz, V. Székely and B. Courtois
-Physics-Based and Compact Models for Self-Heating in High-Speed Bipolar Integrated Circuits
 A. Pacelli, P. Palestri and M. Mastrapasqua
 State University of New York-Stony Brook, US
-Extraction of Coupled RLC Network from Multi-level Interconnects for Full Chip Simulation
 S. Yoon and T. Won
 Inha University, KR
-Simulation of Heterojunction Bipolar Transistor with Domain Decomposition Method
 Y. Zhang and P.P. Ruden
 Oklahoma State University, US
-Compact Modeling of Tunneling Breakdown in PN Junctions for Computer-Aided ESD Design (CAD for ESD)
 Y. Subramanian and R.B. Darling
 University of Washington, US
-Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits
 A.K. Goel and N.R. Eady
 Michigan Technological University, US
-Novel Computing Architecture on Arrays of Josephson Persistent Current Bits
 J. Han and P. Jonker
 Delft University of Technology, LN
-The New Approach to the Power Semiconductor Devices Modelling
 L. Starzak, M. Zubert and A. Napieralski
 Technical University of Lodz, PL
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