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 | Nanotech 2001 Vol. 1
Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Chapter 7: Applications: MEMS, Sensors |
| | Simulation of Shape Memory Devices with Coupled Finite Element Programs | | Authors: | B. Krevet and M. Kohl | | Affilation: | Forschungszentrum Karlsruhe, Germany | | Pages: | 282 - 285 | | Keywords: | shapre memory alloy, finite element method, simulation | | Abstract: | This paper presents thermal and mechanical calculations on micro devices driven by electrical heating of a shape memory alloy (SMA). For simulation a program packages has been developed to allow coupling of single task Finite Element Method (FEM) -programs in an arbitrary sequence, which enables the calcuation and optimization of the performance of complex micro systems. Electrical and thermal calculations are performed with the FEM program Tosca, which was extended by the authors to become a time dependent program for thermal analysis. For the mechanical calculation a three dimensional FEM program has been developed, which is based on a two phase model including history effects to describe the shape memory material. |  | View paper | | ISBN: | 0-9708275-0-4 |
| Pages: | 638 |
| Hardcopy: | $100.00 |
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