MSM 2000
MSM 2000
Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems

Signal Integrity Simulation and Verification Chapter 9

Inductance Calculation in Interconnect Structures
C. Harlander, R. Sabelka and S. Selberherr
Technical University of Vienna, AT

Influence of Element Size on the Precision and Required Computational Effort for 3D FEM Interconnect Capacitance Simulations of ULSI DRAM Cells
A. Hieke
Infineon Technologies Corporation, US

Hybrid P-Element and Trefftz Method for Capacitance Computation
M. Gyimesi, J-S. Wang and D.F. Ostergaard
ANSYS, Inc., US

Wavelet Based Matrix Compression in Numerical Micromagnetics
T. Schrefl, D. Süss and J. Fidler
Vienna University of Technology, AT

Transient Simulation of Ferroelectric Hysteresis
K. Dragosits, R. Hagenbeck and S. Selberherr
Technical University of Vienna, AT

A Methodology for Modeling a Complex Geometry on Wafer from a Layout Data
S. Yoon, O. Kwon and T. Won
Inha University, KR


ISBN: 0-9666135-7-0
Pages: 741

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