 | MSM 2000
Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Chapter 9: Signal Integrity Simulation and Verification |
| - | Inductance Calculation in Interconnect Structures |
| | C. Harlander, R. Sabelka and S. Selberherr |
| | Technical University of Vienna, Austria |
| - | Influence of Element Size on the Precision and Required Computational Effort for 3D FEM Interconnect Capacitance Simulations of ULSI DRAM Cells |
| | A. Hieke |
| | Infineon Technologies Corporation, U.S.A. |
| - | Hybrid P-Element and Trefftz Method for Capacitance Computation |
| | M. Gyimesi, J-S. Wang and D.F. Ostergaard |
| | ANSYS, Inc., U.S.A. |
| - | Wavelet Based Matrix Compression in Numerical Micromagnetics |
| | T. Schrefl, D. Süss and J. Fidler |
| | Vienna University of Technology, Austria |
| - | Transient Simulation of Ferroelectric Hysteresis |
| | K. Dragosits, R. Hagenbeck and S. Selberherr |
| | Technical University of Vienna, Austria |
| - | A Methodology for Modeling a Complex Geometry on Wafer from a Layout Data |
| | S. Yoon, O. Kwon and T. Won |
| | Inha University, Korea |
| ISBN: | 0-9666135-7-0 |
| Pages: | 741 |
| Hardcopy: | $100.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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