A Method for Thermal Model Generation of MEMS Packages
Authors:
M. Rencz, V. Székely, Zs. Kohári and B. Courtois
Affilation:
Micred Ltd., Hungary
Pages:
209 - 212
Keywords:
reduced order models, thermal models, package models
Abstract:
MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.
