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 | MSM 2000
Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Chapter 17: Software Tools, CAD Systems |
| | Wafer Fabrication Process Simulation Including Cost: Which Should be Used in an In-Line Wafer Inspection Strategy, High Sensitivity and High Cost Inspection Machine or Low Sensitivity and Low Cost Inspection Machine? | | Authors: | K. Nakamae, S. Yamaji and H. Fujioka | | Affilation: | Osaka University, Japan | | Pages: | 700 - 703 | | Keywords: | wafer fabrication, inspection process, remedy, sampling inspection, particle | | Abstract: | By combing an event-driven simulation method including costs and a simple VLSI particle-induced yield predictor, we discuss that which should be used in an in-line wafer inspection strategy, a high sensitivity & high cost inspection machine or a low sensitivity & low cost inspection machine. Two segments of a DRAM fab line including the inspection and the defect sourcing stages are modeled. Simulated results show that setting an adequate wafer rejection condition and selecting a proper sampling plan obtain the minimum cost per chip regardless of the kind of inspection machine. |  | View paper | | ISBN: | 0-9666135-7-0 |
| Pages: | 741 |
| Hardcopy: | $100.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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