Recent Press Releases
Tegal Corporation (NASDAQ:TGAL), an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced that its consolidated financial statements for the fiscal year ended March 31, 2009, included in the Company's annual report on Form 10-K filed with the Securities and Exchange Commission on June 26, 2009, contained a going concern qualification from its independent registered public accounting firm. This announcement is being made in compliance with Nasdaq Marketplace Rule 4350(b)(1)(B), which requires separate disclosure of a recent audit opinion that contains a going concern qualification. This announcement does not represent any change or amendment to the Company's 2009 financial statements or to its annual report on Form 10-K.
(07/02/09 04:01 PM EST)
High Speed SiGe Process Replaces 8 GaAs Chips, Lowering Cost and Increasing Integration
(07/02/09 04:00 AM EST)
SUSS MicroTec (FWB:SMH)(GER:SMH), one of the world’s leading suppliers of process and test solutions for microstructuring applications in semiconductor and related markets, today announced a new structure for sales in Asia based in Singapore. With the consolidation of the sales office in Bangkok (Thailand) having administered sales and service for lithography and wafer bonder equipment in Asia and the former Singapore office of SUSS MicroTec Test Systems to a joint sales office for the three product lines in Singapore and with the appointment of ZMC Technologies as general sales representative for Malaysia, Singapore and Philippines SUSS MicroTec reinforces its strong presence in Asia already maintaining sales offices in Seoul (Korea), Shanghai (China), Yokohama (Japan) and Hsinchu (Taiwan). SUSS MicroTec now also operates two fully equipped application centres in Yokohama and Singapore and provides realtime after-sales support for both process and test solutions to its Asian customers.
(07/01/09 12:15 PM EST)
New FE-SEM combines high resolution and analysis for the first time
(07/01/09 10:00 AM EST)
Semiconductor and Solar Industry Veteran Brings Extensive Technology Expertise and Experience
(07/01/09 09:04 AM EST)
Today KLA-Tencor Corporation (NASDAQ:KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related industries, announced XP, a new upgrade package for 28xx broadband brightfield inspection systems. The XP package is the first commercially available product to give an inspection system access to standard IC design layout files — the instructions that enable mask shops to pattern the mask. With access to this information, the inspection system can use knowledge of the defect’s location within the circuit to better estimate its probability of affecting device yield. In addition, XP can use the results of the design-aware wafer inspection to identify features on the mask that may be particularly sensitive to process variations during printing. These and other features of the XP upgrade package are designed to improve the sensitivity and productivity of existing 28xx inspectors and raise the information content of defect results, helping to accelerate identification and resolution of defect issues.
(06/30/09 04:30 PM EST)
Panavision Imaging LLC, a pioneering innovator and developer of high performance CMOS image sensors, and Tower Semiconductor, Ltd. (Nasdaq:TSEM) (TASE:TSEM), a leading global specialty foundry, today announced production of Panavision’s family of DLIS-2K re-configurable line scan CMOS image sensors. The DLIS-2K sensors were developed using Tower’s Advanced Photo Diode (APD) pixel process and pixel IP with Panavision’s patented Imager Architecture. These re-configurable linear image sensors offer high performance at a low cost and combine high sensitivity, high speed, and versatility to address many applications in consumer, industrial, automotive, and scientific markets.
(06/30/09 04:00 AM EST)
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