Event News

June 18-21,
Santa Clara, CA, US

How To Participate!

Submit Venture!
Deadline April 21! Showcase Your Innovation! Deadline May 1! Register to Attend!
Early Bird Rate Through April 26!

TechConnect World 2012 Corporate Partners Include:
Applied Materials
BASF
Bayer MaterialScience
bp
Dow
DuPont
General Electric
Honda
IBM
Intel
Johnson Controls
Kodak
Lockheed Martin
Merck
MeadWestvaco
Novartis
Panasonic
PPG Industries
Roche
Schlumberger
Shell
Siemens
Toray

Innovation & Investment:

CTSI Utility Technology Challenge Names 25 Semifinalists, Now One Step Closer to $100K Demonstration Funds - The 25 semi-finalists are recognized for exceptional promise in the areas of: pollution monitoring and reduction, HVAC, transportation, distributed generation, building and energy efficiency, energy storage, natural gas, smart grid, and transmission and distribution...Read more

Microsoft and Nokia to Invest $23+ US Million in New Mobile Application Development Program in Finland - Finland’s Aalto University will house the AppCampus Program for the two technology giants. Grant applications open this May...Read more

Don’t Miss Your Chance to Present at TechConnect Venture Forum 2012! Accepting Submissions for Conference Consideration Through April 21st! - The annual Venture Forum is ideal for start up companies to present market advantages and search for corporate partners and funders...Read more

Accolades Continue for Boeing's 787 Dreamliner - Innovations in 787 Dreamliner include use of composite materials and fuel-efficient engines, making it the world's most technologically advanced commercial aircraft...Read more

MesoCoat Completes Major Milestone: Cladding Inside Diameter of Steel Pipe with Anti-Corrosion and Wear Resistent Alloys - MesoCoat, a nanotechnology materials science company, was selected to present at the 2011 TechConnect-Nanotech Venture Forum in Boston...Read more

Using Femtosecond Lasers, Harvard Researchers Make Advances in Nanoscale Metal Lithography - Harvard's novel fab process allows for lithography at three dimensions and at a high resolution for creation of metamaterials...Read more

Applied Materials and A*Star's Institute of Microelectronics-SG, to Drive Advanced 3D Packaging with World-Class R&D Lab in Singapore - Joint R&D Centre is first dedicated facility of its kind focused on developing next-generation packaging technologies to feed the explosive growth of mobile devices...Read more

Nanotube Technology Leading to Fast, Lower-Cost Medical Diagnostics - Researchers at Oregon State University have tapped into the extraordinary power of carbon "nanotubes" to increase the speed of biological sensors...Read more

Could Bugs Hold the Key to More Eco-Friendly Detergents? - Fraunhofer-DE Researchers Studying Bugs and Fungi to Engineer Novel Surfactants...Read more

New Sky Energy, past TechConnect World Venture Presenter, Wins Imagine H2O's Early Revenue Track Prize - Start up company was selected as one of nine finalists in Imagine H20's 2012 Water Innovation Competition...Read more

Australia and Korea Universities Come Together to Develop Next-Generation Solar Cells - The University of Queensland and Yonsei University are combining their expertise in areas of polymer patterning and materials science...Read more

Submissions Now Open! Ventures Due April 21! Innovation Showcase Deadline May 1! Register to Attend! Early Bird Rate Through April 26! TechConnect 2012! June 18-21, Santa Clara, CA, US...www.techconnectworld.com