US Department of Energy, Office of Science
Rajeev Ram’s primary focus at ARPA-E is in advanced electrical components and systems ranging from transportation to the generation and transmission of electric power. He has worked in the areas of semiconductor devices, microscopic heat transfer, and bioprocess development for much of his career. In the early 1990’s, he developed the III-V wafer bonding technology that led to the fist telecom wavelength surface-emitting laser and record brightness light emitting devices at Hewlett-Packard Laboratory in Palo Alto. Since 1997, Ram has been on the Electrical Engineering faculty at the Massachusetts Institute of Technology (MIT) and a member of the Research Laboratory of Electronics. While at MIT, he founded two companies in the areas of bioprocess development for biofuels and advanced thermal imaging. He has served on the Defense Sciences Research Council advising DARPA on new areas for investment. His group’s work on small-scale solar thermoelectric generation is being deployed for rural electrification in the developing world as SolSource and was recognized with the St. Andrews Prize for Energy and the Environment in 2009. Ram holds degrees in Applied Physics from California Institute of Technology and Electrical Engineering from the University of California, Santa Barbara.